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+Orone-mini-S8D-v0r001
+Copyright 2013 G Bulmer
+
+This work is licensed under a Creative Commons Attribution-ShareAlike 3.0 Unported License.
+I ask that my name remain visible in the copper.
+
+The pin headers are standard 'breadboard friendly' 0.1" pitch.
+The two rows of pin headers are 0.8" apart, and hence fit a single breadboard.
+The board is 2.3" long x 1" high. Most components are 1206 or larger.
+
+1206 components are too big to fit in mini-like 2.1" length
+Hence the board is lengthened from 2.1" to 2.3"
+Replaced C1 with 7343-case size
+
+Design Rules: OSHPark.com & Seeedstudio 'Fusion' PCB Service
+
+Routing
+Crystal tracks & Top Layer MCU tracks are 6mil/6mil in order to make enough space for components and isolation.
+All tracks from thru-hole (hand soldered) components, except pin headers, are 10mil or wider. This is intended to make the tracks more robust.
+
+All Bottom Layer tracks are 10mil or bigger, except Crystal tracks; this is intended to be easier to make.
+
+Copper pours have 10mil isolation; this is intended to be easier to make.
+
+Vias: The three via shapes are used to give information, and help 'read' the PCB.
+VIA KEY
+SQUARE:  Digital Ground (DGND) and thermal vias
+ROUND:   Signal
+OCTAGON: Power (e.g. Vcc) or segregated Ground (e.g. AGND)
+
+Notes
+There are four Hidden Airwires, which do not need routing (replicated on switches)
+For safety, type 'RATSNEST *' to make them visible before making any changes
+Two pads 33 and DISC, printed at 45 degrees, are signals, and not for components.
+DRC->Restring Pads & Vias minimum increased from OSHPark 7mil to 10mil to support more PCB manufacturers design rules by providing larger annular rings.