Added USB-Mini-Molex.lbr which contains three different footprints for the Molex socket. Updated README files to reflect untested status.

4 files changed, 12 insertions, 2 deletions

diff --git a/Orone-mini-v0/Library/USB-Mini-Molex.lbr b/Orone-mini-v0/Library/USB-Mini-Molex.lbr
new file mode 100644
index 0000000..910a60c
--- /dev/null
+++ b/Orone-mini-v0/Library/USB-Mini-Molex.lbr
diff --git a/Orone-mini-v0/Orone-mini-S8A-v0r001/README b/Orone-mini-v0/Orone-mini-S8A-v0r001/README
index 32ae63b..506c72e 100644
--- a/Orone-mini-v0/Orone-mini-S8A-v0r001/README
+++ b/Orone-mini-v0/Orone-mini-S8A-v0r001/README
@@ -48,4 +48,8 @@ The Maple-mini has SMD parts on both sides of the board. This is relatively diff
 
 PCB Design Rules
 ----------------------
-The Printed Circuit Board has been designed using the manufacturing tolerances supported by OSHPark.com and Seeedstudio 'Fusion PCB service'. There is one specific area which is flagged as an error, but is manufacturable. A special component called a 'bridge' is used to create a separate ground layer around the crystal oscillator is used. The separate ground should significantly reduce electrical noise transmission from the crystal oscillator. Eagle treats the bridge as two overlapping tracks, and flags clearance and overlap errors. These should be safe to ignore. 
+The Printed Circuit Board has been designed using the manufacturing tolerances supported by OSHPark.com and Seeedstudio 'Fusion PCB service'. 
+
+There is a 'bridge' which is flagged as an error, but is manufacturable. The bridge is two touching pieces of copper, and looks like a piece of copper track. It is used to create a separate ground layer around the crystal oscillator. The separate ground should significantly reduce electrical noise transmission from the crystal oscillator. Eagle treats the bridge as two overlapping tracks, and flags clearance and overlap errors. These should be safe to ignore. 
+
+The other errors come from the vias within the 'tab' pin of the REG1 regulator. They have no impact on manufacturing the PCB, and can be ignored. The vias should conduct heat through to the larger area of copper on the reverse side of the board. There are several other 'heat-path vias' in the component side copper pour, but these should be more effective. 
diff --git a/Orone-mini-v0/README b/Orone-mini-v0/README
index f0b32b2..bce876d 100644
--- a/Orone-mini-v0/README
+++ b/Orone-mini-v0/README
@@ -12,6 +12,11 @@ The focus for Orone-mini is improving Maple-mini:
 
 Orone-mini-S8A-v0r001 - Maple-mini compatible STM32F development board. 
 Incorporates all 5 improvement areas
-Format: two 20pin headers 0.8" apart. 1206 Components, SOT-223 voltage regulator uses LM2937 'tab-is-ground' footprint
+Format: two 20pin headers 0.8" apart. 1206 Components, SOT-223 voltage regulator uses LM2937-style, 'tab-is-ground', footprint
+Not yet tested.
 
 
+
+
+Thanks to: 
+Mark Rafter and Jeff Smith; Pete Harrison, Tony Wilcox, Chris Evans and David Hannaford of Midlands Micromouse and Robotics Club for advice, encouragement and expertise; Keith, Pete and Bill of Techwizz for discussions and feedback; Siy, feurig, ala42, Crenn, and everyone who contributed at LeafLabs forum. Special thanks to LeafLabs for developing the Maple-IDE and Maple-mini.
diff --git a/README b/README
index 4c77888..2d7a6e3 100644
--- a/README
+++ b/README
@@ -59,6 +59,7 @@ Subdirs:
 		than Maple-mini. It is otherwise software and pin-compatible 
 		with Maple-mini (exception is 'av+' which is intended to 
 		improve the power supply capability). 
+                Not yet tested.
 
 	PiXe-2: 'Stamp' format, 64pin STM32F103 MCU. Eagle 5.1
                 Features: